Above 5 ghz the buried capacitance becomes the necessity to provide sufficient decoupling. Approved zbc 2000 substrate available for thinner more reliable assemblies and increased board densities high tg fr 4 processing processes similar to traditional high tg fr 4 materials 90 min press at 193ºc and 275 350 psi available in a variety of constructions vacuum laminated. This technique allows for the removal of discrete decoupling capacitors clearing board space and enabling.
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